We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Chip mounting.
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Chip mounting Product List and Ranking from 6 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Chip mounting Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. マイクロモジュールテクノロジー Kanagawa//Manufacturing and processing contract
  2. ピーダブルビー 草津事業所 Shiga//Industrial Electrical Equipment
  3. エスタカヤ電子工業 Okayama//Electronic Components and Semiconductors
  4. グロース Kanagawa//Electronic Components and Semiconductors
  5. 5 JOHNAN DMS Kyoto//Electronic Components and Semiconductors
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Chip mounting Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Micro Module Technology Corporation - Business Overview マイクロモジュールテクノロジー
  2. Flip chip mounting ピーダブルビー 草津事業所
  3. Flip chip mounting エスタカヤ電子工業
  4. Bear chip implementation グロース
  5. 4 Introduction to miniaturization services for products through high-density packaging. JOHNAN DMS

Chip mounting Product List

1～7 item / All 7 items

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Bear chip implementation

Bear chip implementation

Consistent production from circuit board design to bare chip mounting! Abundant experience with high-difficulty projects.

We provide consistent support from circuit board design to ensure the characteristics of the entire module, rather than just partial implementation work, through wire bonding and flip chip mounting. We possess extensive know-how in the fields of wire bonding and flip chip using bare chips, and we may be able to resolve cases that other companies have declined. We are always mindful of cost and delivery time, and we can assist from the planning stage, so if you are a development manager facing challenges with bare chip mounting, please feel free to consult with us. 【Features】 ■ Support for small lots (from 1 piece) ■ Quick turnaround ■ Capable of mixed mounting with SMT components and leaded components *For more details, please refer to the related links or feel free to contact us.

  • Circuit board design and manufacturing

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ベアチップ実装＜高難度案件に対応＞

ベアチップ実装＜高難度案件に対応＞

豊富な実績で構想段階からご対応！車載、ハイブリッドIC、液晶ディスプレイなどに

当社では、基板設計から「ベアチップ実装」まで一貫生産を 行っております。 ワイヤボンディングをはじめ、フリップチップ、ダイシング といった高難度案件に対応。 微細素子高密度実装試作や高集積化実装、パッケージ開封による 障害解析などの実例がございます。 【サービスメニュー】 ■ワイヤボンディング ■フリップチップ ■ダイシング ※詳しくはPDFをダウンロードしていただくか、お気軽にお問い合わせください。

  • Circuit board design and manufacturing

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Micro Module Technology Corporation - Business Overview

Micro Module Technology Corporation - Business Overview

Support for miniaturization and modularization of circuit implementation boards using bare chip implementation, from concept to prototype to mass production!

We pursue micro-joining technology for bare chip mounting and inter-board connections, supporting the creation and realization of high-value-added products and the enhancement of global competitiveness. From concept to development design, prototyping, evaluation, analysis, and small to medium-scale mass production, we provide a one-stop service at our in-house factory (clean room class: 100 to 1000). We will realize bare chip mounting, which has been difficult to implement cost-effectively for small-scale production, through our module technology and manufacturing capabilities. **Benefits of Bare Chip Mounting** - **Increased Added Value** → Miniaturization and thinning expand product applications and create new markets. → Incorporating semiconductor backend processes enhances manufacturing added value. - **Improved Cost Competitiveness** → Miniaturization and standardization improve production efficiency and reduce material costs. → Compared to miniaturization through System on Chip (SoC), development costs can be reduced to about one-tenth. - **Enhanced Performance** → The elimination of secondary wiring in semiconductor packages significantly shortens wiring length, improving performance degradation due to wiring loss. - **Environmental Considerations** → Reducing the number of materials used can decrease waste.

  • Circuit board design and manufacturing

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Flip chip mounting

Flip chip mounting

Implementation technology for directly mounting LSI bare chips.

Flip chip mounting is one method of mounting bare chips. Compared to wire bonding, it allows for a smaller mounting area and has better electrical characteristics due to shorter wiring. Even though it is called flip chip mounting, there are multiple mounting methods available, and we can propose a method based on your requirements. - It can accommodate a minimum pitch of 80 microns. - It is also possible to mix mount with SMT components.

  • Printed Circuit Board
  • Prototype Services
  • Other semiconductors

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Flip chip mounting

Flip chip mounting

Implementation of flip chips with bear chips and glass chips.

The flip chip structure can reduce the mounting area compared to wire bonding. Flip chip mounting of bare chips is performed on flexible substrates, rigid substrates, and ceramic substrates. In addition to GGI (Gold to Gold Interconnection) and ACF/ACP (Anisotropic Conductive Film/Paste), there are many other methods for flip chip technology, and we will propose the method you require. We suggest implementing glass on the bare chip. We will also propose the processes following the flip chip as per your requirements.

  • Other semiconductors

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[Example of Problem Solving] Chip Manufacturer

[Example of Problem Solving] Chip Manufacturer

We will introduce examples of implementing heat-resistant fragile chip mounting, low thermal stress mounting, and large chip mounting.

We would like to introduce a case study of our response to chip manufacturers. Even though they developed high-performance and high-functionality chips for sensors, high-speed communication, processors, etc., they faced challenges such as not having a subcontractor for implementation to realize those functions, being unable to implement thermally fragile chips, and being unable to implement large-area chips. As a result, we carried out implementations for thermally fragile chips, low thermal stress implementations, and large chip implementations. [Case Overview (Excerpt)] ■ Implementation of thermally fragile chips - Achieved implementation of a 140°C heat-resistant magnetic sensor array ■ Low thermal stress implementation - Achieved implementation of a 40mm ultrasonic MEMS sensor chip *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing

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Introduction to miniaturization services for products through high-density packaging.

Introduction to miniaturization services for products through high-density packaging.

Supports ultra-small chip mounting on various substrate materials, as well as high-speed and multi-variety component mounting.

JOHNAN DMS Corporation contributes to the miniaturization and modularization of products through high-density mounting, such as 0201 implementation and minimum 0.1mm gap mounting. We support consistent manufacturing from substrate mounting to product assembly, inspection, and finished products, accommodating ultra-small chips. Target substrates: aluminum substrates, flexible substrates, high multilayer substrates, paper substrates, paper phenol, PET film, etc. For more detailed service information (supported substrates, types of solder, mounting capabilities), please visit our website. https://www.johnan.com/dms/mounting/pcb/ 【Contact Information】 TEL: 0774-43-1431 Website: https://www.johnan.com/dms/contact/

  • Other electronic parts

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